2 July 2014

Special issue published: "Advances in Electronic Materials and Application"

International Journal of Materials and Product Technology 49(1) 2014

Expanded versions of papers presented at the 2013 2nd International Conference on Applied Materials and Electronics Engineering (AMEE 2013).
  • Prediction of fatigue life of packaging EMC material based on RBF-SVM
  • Design and fabrication of a metal-based asymmetric and variable Y-branch plastic optical fibre coupler
  • Punch-through and junction breakdown characteristics for uniaxial strained nano-node metal-oxide-semiconductor field-effect transistors on (100) wafers
  • Software architecture and stress tracker utilising nanofibre technique-based smart clothes
  • A study of the nanomachining and nanopatterning on different materials using atomic force microscopy
  • Removing the transients electron trapping in P-N junction diode by using soft X-ray annealing method

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