22 June 2008

Special issue: Damage in electronic materials

International Journal of Materials and Structural Integrity 2(1/2) 2008
  • Fracture toughness characterisation of electronic materials and interfaces
  • Thermomigration in lead-free solder joints
  • Impact of miniaturisation on solder joint reliability
  • Reliability of PWB microvias for high density package assembly
  • Damage mechanics of solder joints – viscoplasticity, implementation, simulation, and verification
  • Effects of radiation damage in GaN and related materials
  • Thermodynamic framework for coupling of elasto-viscoplasticity and nonlocal anisotropic damage for microelectronics solder alloys
  • Accelerated aging and thermal-mechanical fatigue modelling of Cu-plated through holes with partial solder filling
  • Estimating fatigue damage model constants with maximum likelihood method
  • Microstructure evolution based acceleration factor determination for SnAgCu solder joints during thermal cycling

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