Special issue: Damage in electronic materials

International Journal of Materials and Structural Integrity 2(1/2) 2008

• Fracture toughness characterisation of electronic materials and interfaces
• Thermomigration in lead-free solder joints
• Impact of miniaturisation on solder joint reliability
• Reliability of PWB microvias for high density package assembly
• Damage mechanics of solder joints – viscoplasticity, implementation, simulation, and verification
• Effects of radiation damage in GaN and related materials
• Thermodynamic framework for coupling of elasto-viscoplasticity and nonlocal anisotropic damage for microelectronics solder alloys
• Accelerated aging and thermal-mechanical fatigue modelling of Cu-plated through holes with partial solder filling
• Estimating fatigue damage model constants with maximum likelihood method
• Microstructure evolution based acceleration factor determination for SnAgCu solder joints during thermal cycling