- Computational implementation of Cosserat continuum
- Character of the magnetic monopole field
- Thermo-mechanical behaviour of a micromirror for laser-to-fibre active alignment using bimorphs with breakable tethers
- Liquid crystal polymer for RF MEMS packaging
- The integration of nanowires and nanotubes with microstructures
- Sintered nanosilver paste for high-temperature power semiconductor device attachment
- An investigation of combined size, rate and thermal effects on the material properties of single crystal diamond
- Use of stress-engineered material layers for the measurement of interfacial fracture toughness of nanoscale thin films
- A robust digital image correlation technique for high-resolution characterisation of microelectronic packaging materials
- Heat transfer with nanofluids for electronic cooling
- On the thermodynamics of higher-order gradient plasticity for size-effects at the micron and submicron length scales
- Development of cryogenic power modules for superconducting hybrid power electronic system
- A study of mechanical and thermal properties of materials in electronic packaging: application of micro DIC
5 January 2009
Special issue: Micro/nanoelectronics and NEMS and MEMS packaging
International Journal of Materials and Product Technology 34(1/2) 2009
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