Special issue: Micro/nanoelectronics and NEMS and MEMS packaging

International Journal of Materials and Product Technology 34(1/2) 2009

• Computational implementation of Cosserat continuum
• Character of the magnetic monopole field
• Thermo-mechanical behaviour of a micromirror for laser-to-fibre active alignment using bimorphs with breakable tethers
• Liquid crystal polymer for RF MEMS packaging
• The integration of nanowires and nanotubes with microstructures
• Sintered nanosilver paste for high-temperature power semiconductor device attachment
• An investigation of combined size, rate and thermal effects on the material properties of single crystal diamond
• Use of stress-engineered material layers for the measurement of interfacial fracture toughness of nanoscale thin films
• A robust digital image correlation technique for high-resolution characterisation of microelectronic packaging materials
• Heat transfer with nanofluids for electronic cooling
• On the thermodynamics of higher-order gradient plasticity for size-effects at the micron and submicron length scales
• Development of cryogenic power modules for superconducting hybrid power electronic system
• A study of mechanical and thermal properties of materials in electronic packaging: application of micro DIC