14 August 2015

Free sample articles newly available from International Journal of Materials and Structural Integrity

The following sample articles from the International Journal of Materials and Structural Integrity are now available here for free:
  • A two-stage approach optimising PCB assembly on the sequential pick-and-place machine by a score-based slot selection method and a swarm intelligence approach
  • A research review on deep cryogenic treatment of steels
  • Mechanical property of a graphene/silicon interface: an atomistic simulation research
  • Study on crosstalk fault model and testing for SoC inter-core interconnects
  • Vibration analysis for roll system of KOCKS mill based on ADAMS
  • Thermo-mechanical coupled modelling on fixed joint interface in machine tools
  • Interfacial heat transfer properties of the typical interconnection structures in IC packaging: a multiscale study
  • Multiple Al micro materials fabrication by utilising electromigration
  • Effect of reflow temperature on the mechanical drop performance of Sn-Bi solder joint
  • Effects of Pd layer thickness on mechanical properties and microstructures of Sn-3.0 Ag-0.5 Cu solder joints
  • Shear strengths of CBGA/PBGA solder ball joints with lead-free solder pastes
  • Evaluation of lead-free solder reliability under vibration at elevated temperature
  • Microstructure and drop/shock reliability of Sn-Ag-Cu-In solder joints
  • Reflow of lead-free solder by microwave heating
  • Measurement of the local residual stress between fine metallic bumps in 3D flip chip structures
  • Thermal fatigue life prediction of solder joints of plastic ball grid array packages

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