15 September 2014

Special issue published: "Recent Studies on the Reliability of Microelectronic Materials and Devices"

International Journal of Materials and Structural Integrity 8(1/2/3) 2014
  • Thermal fatigue life prediction of solder joints of plastic ball grid array packages
  • Measurement of the local residual stress between fine metallic bumps in 3D flip chip structures
  • Reflow of lead-free solder by microwave heating
  • Microstructure and drop/shock reliability of Sn-Ag-Cu-In solder joints
  • Evaluation of lead-free solder reliability under vibration at elevated temperature
  • Shear strengths of CBGA/PBGA solder ball joints with lead-free solder pastes
  • Effects of Pd layer thickness on mechanical properties and microstructures of Sn-3.0 Ag-0.5 Cu solder joints
  • Effect of reflow temperature on the mechanical drop performance of Sn-Bi solder joint
  • Multiple Al micro materials fabrication by utilising electromigration
Additional papers
  • Interfacial heat transfer properties of the typical interconnection structures in IC packaging: a multiscale study
  • Thermo-mechanical coupled modelling on fixed joint interface in machine tools
  • Vibration analysis for roll system of KOCKS mill based on ADAMS
  • Study on crosstalk fault model and testing for SoC inter-core interconnects
  • Mechanical property of a graphene/silicon interface: an atomistic simulation research
  • A research review on deep cryogenic treatment of steels
  • A two-stage approach optimising PCB assembly on the sequential pick-and-place machine by a score-based slot selection method and a swarm intelligence approach

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