Special issue published: "Recent Studies on the Reliability of Microelectronic Materials and Devices"

International Journal of Materials and Structural Integrity 8(1/2/3) 2014

• Thermal fatigue life prediction of solder joints of plastic ball grid array packages
• Measurement of the local residual stress between fine metallic bumps in 3D flip chip structures
• Reflow of lead-free solder by microwave heating
• Microstructure and drop/shock reliability of Sn-Ag-Cu-In solder joints
• Evaluation of lead-free solder reliability under vibration at elevated temperature
• Shear strengths of CBGA/PBGA solder ball joints with lead-free solder pastes
• Effects of Pd layer thickness on mechanical properties and microstructures of Sn-3.0 Ag-0.5 Cu solder joints
• Effect of reflow temperature on the mechanical drop performance of Sn-Bi solder joint
• Multiple Al micro materials fabrication by utilising electromigration

Additional papers

• Interfacial heat transfer properties of the typical interconnection structures in IC packaging: a multiscale study
• Thermo-mechanical coupled modelling on fixed joint interface in machine tools
• Vibration analysis for roll system of KOCKS mill based on ADAMS
• Study on crosstalk fault model and testing for SoC inter-core interconnects
• Mechanical property of a graphene/silicon interface: an atomistic simulation research
• A research review on deep cryogenic treatment of steels
• A two-stage approach optimising PCB assembly on the sequential pick-and-place machine by a score-based slot selection method and a swarm intelligence approach